This week at SC16, Huawei launched their next-generation FusionServer X6000 HPC platform. Designed for compute-intensive workloads, the FusionServer X6000 offers higher efficiency and greater flexibility than previous systems. The X6000 HPC platform uses an innovative liquid cooling solution that features a skive fin micro-channel heat sink for CPU heat dissipation and processing technology where water flows through memory modules. The platform delivers a node liquid cooling percentage greater than 85%. Its modular design and 50ºC warm water cooling function offers customers high energy-efficiency and flexible deployment, and reduces total cost of ownership (TCO) by up to 40% for large-scale deployment. Learn more at http://insidehpc.com/2016/11/huawei-launches-new-generation-hpc-platform-fusionserver-x6000-at-sc16/